APR SolderPasteDippingPlate

$150.00
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SKU:
APR SolderPasteDippingPlate
Weight:
5.00 LBS
Shipping:
Calculated at Checkout
APR Flux/Paste Dip Plate 1

Maximum file size is 20000,

Maximum file size is 20000,

Maximum file size is 20000,

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on to a board or other device. It can also be used to dip flux of pre-bumped device.

These plates are custom-made and can be ordered to accommodate different component sizes and ball diameters.

The dipping plates can be used as stand-alone entities or be used with the tooling holes on APR rework systems.

Delivery is 2-3 days after drawing approval by the customer.

In order to get started we require the following:

  1. Part mechanicals
  2. Type of machine the plate will be used with or free-standing