BGA Reballing Preform -Configurable

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EZReball(TM) BGA Reballing Preform
0.50 LBS
Calculated at Checkout
Placing the device on to the reballing preform

Maximum file size is 10, file types are bmp, gif, jpg, jpeg, jpe, jif, jfif, jfi, png, wbmp, xbm, tiff

This is a unique BGA reballing stencil. It improves first pass yields and makes the reballing of devices fast and simple.

This BGA reballing stencil allows you to easily change alloys or reball devices after their removal.

BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305), high temp

More information on the testing of this device can be found here.

  • Minimum Aperture Size: .002in (.05mm)
  • Stencil Material: High temperature Polyimide with tacky, porous tape which cleans up with IPA.
  • Minimum Pitch: 1.50-0.50mm pitch
  • Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)

We accept either standard GERBER files, part data sheets or CAD files.

This configurable part number for this reballing stencil means you do not have to sort through all of the patterns listed (there are many more).

If you need an EZReball(TM) in a pitch smaller than 0.5mm pitch order here.

The data you send us to make your part must have:

         # of solder balls

         Pattern of the solder array incl dimensions

         Overall package size

         Ball size

We will send you a checkplot/drawing of the device we will fabricate for you.

EZReball(TM) BGA reballing stencils are packaged in groups of (15) in clam shell packaging.

Standard lead time is (3) business days for 2 packs.

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  • 5
    Billy T

    Posted by No Messy Paper Remnants on 19th Jun 2017

    Somehow came across these and they are far easier to use than the paper ones. The clean up much simpler and faster post recalling.

  • 4
    Got the job done right

    Posted by Joanne on 19th Dec 2016

    Thanks Chris and crew for shipping my preforms out early!

  • 4
    Easy to use

    Posted by Xuang on 28th Oct 2016

    Simple product to understand and use

  • 4
    Fast delivery

    Posted by Xutiopias on 25th Oct 2016

    Thanks for the fast delivery

  • 4
    Fast shipment

    Posted by Livingston on 6th Sep 2016

    We had the custom product within 4 days via air shipment

  • 5
    Simple to Use

    Posted by Fred G on 4th Apr 2015

    Fast and quick once you get the hang of this. Novel device!

  • 4
    Nice product for 0.4mm pitch BGA

    Posted by Boinga T on 30th Nov 2014

    Once I got in touch with Katy things sailed along-otherwise a little "choppy" to begin with on the web site.

  • 5
    Got my 130 ball chip re-balled on the first try

    Posted by Unknown on 20th Nov 2014

    I took a photo-micrograph of the re-balled part with some common table salt and the size comparison made those .30mm balls look so tiny. No more hand re-balling for me. Pays for it's self in time saved.

  • 5
    Fast and painless

    Posted by Mumhtar on 20th Feb 2014

    Chris helped me out. Got me a drawing of the preform would look like. It shipped a few days later. Product works great!