BGA Reballing Preform -Configurable

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EZReball(TM) BGA Reballing Preform
0.50 LBS
Calculated at Checkout
Placing the device on to the reballing preform

This is a unique BGA reballing stencil. It improves first pass yields and makes the reballing of devices fast and simple.

This BGA reballing stencil allows you to easily change alloys or reball devices after their removal.

BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305), high temp

More information on the testing of this device can be found here.

  • Minimum Aperture Size: .002in (.05mm)
  • Stencil Material: High temperature Polyimide with tacky, porous tape which cleans up with IPA.
  • Minimum Pitch: 1.50-0.50mm pitch
  • Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)

We accept either standard GERBER files, part data sheets or CAD files.

This configurable part number for this reballing stencil means you do not have to sort through all of the patterns listed (there are many more).

If you need an EZReball(TM) in a pitch smaller than 0.5mm pitch order here.

The data you send us to make your part must have:

         # of solder balls

         Pattern of the solder array incl dimensions

         Overall package size

         Ball size

We will send you a checkplot/drawing of the device we will fabricate for you.

EZReball(TM) BGA reballing stencils are packaged in groups of (15) in clam shell packaging.

Standard lead time is (3) business days for 2 packs.

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19 Reviews Hide Reviews Show Reviews

  • 5
    Simple to Use

    Posted by Fred G on 4th Apr 2015

    Fast and quick once you get the hang of this. Novel device!

  • 4
    Nice product for 0.4mm pitch BGA

    Posted by Boinga T on 30th Nov 2014

    Once I got in touch with Katy things sailed along-otherwise a little "choppy" to begin with on the web site.

  • 5
    Got my 130 ball chip re-balled on the first try

    Posted by Unknown on 20th Nov 2014

    I took a photo-micrograph of the re-balled part with some common table salt and the size comparison made those .30mm balls look so tiny. No more hand re-balling for me. Pays for it's self in time saved.

  • 5
    Fast and painless

    Posted by Mumhtar on 20th Feb 2014

    Chris helped me out. Got me a drawing of the preform would look like. It shipped a few days later. Product works great!

  • 5
    Simple to Use, Good customer servive

    Posted by Ralph G on 29th Dec 2013

    Product is easy as long as you follow the video. Chris was nice

  • 4
    Fast delivery, works well

    Posted by David T on 23rd Dec 2013

    I had been using the paper preforms. These are a very good alternative as there are no toolings costs.

  • 5
    Ultra Fine Pitch Solved

    Posted by Susan M on 8th Dec 2013

    I have been looking for someone to find me a good answer for my 0.35mm pitch CSPs. This was a good solution!

  • 5
    Fast shipping

    Posted by Jericho K on 17th Oct 2013

    Got the preforms in 4 days after submitting and approving the checkplot on a new pattern. No extra $ like WS.

  • 5
    Even tiny devices can be reballed

    Posted by Laurent L on 7th Oct 2013

    I had a 0.4mm pitch with 10 mil ball BGA that needed to have new balls placed on it after the device was taken off the board. This was a neat easy way to do this myself.