BGA Reballing Preform -Configurable

$126.00
SKU:
EZReball(TM) BGA Reballing Preform
Weight:
0.50 LBS
Shipping:
Calculated at Checkout
Current stock: 0
Description

Description

This is a unique BGA reballing stencil. It improves first pass yields and makes the reballing of devices fast and simple.

This BGA reballing stencil allows you to easily change alloys or reball devices after their removal.

BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305), high temp

More information on the testing of this device can be found here.

  • Minimum Aperture Size: .002in (.05mm)
  • Stencil Material: High temperature Polyimide with tacky, porous tape which cleans up with IPA.
  • Minimum Pitch: 1.50-0.50mm pitch
  • Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)

We accept either standard GERBER files, part data sheets or CAD files.

This configurable part number for this reballing stencil means you do not have to sort through all of the patterns listed (there are many more).

If you need an EZReball(TM) in a pitch smaller than 0.5mm pitch order here.

The data you send us to make your part must have:

         # of solder balls

         Pattern of the solder array incl dimensions

         Overall package size

         Ball size

We will send you a checkplot/drawing of the device we will fabricate for you.

EZReball(TM) BGA reballing stencils are packaged in groups of (15) in clam shell packaging.

Standard lead time is (3) business days for 2 packs.

Reviews

Reviews (19)

Boinga T 30th Nov 2014

Nice product for 0.4mm pitch BGA

Once I got in touch with Katy things sailed along-otherwise a little "choppy" to begin with on the web site.

20th Nov 2014

Got my 130 ball chip re-balled on the first try

I took a photo-micrograph of the re-balled part with some common table salt and the size comparison made those .30mm balls look so tiny. No more hand re-balling for me. Pays for it's self in time saved.

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