BGA Rework Stencil-Reorder

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Copy of StencilQuik(TM) BGA Rework Stencil
0.50 LBS
Calculated at Checkout
BGA stay in place stencil

This is a unique stenciling BGA rework stencil system. It improves first pass yields and repairs solder mask that may have been damaged during device .

This configurable part number means you have already ordered this part and have a valid existing part number. If you have an existing competitive part number we can take that order here without tooling charges.

StencilQuik(TM) is available in  (3) thicknesses-0.004", 0.006" and 0.008" thick.

StencilQuik(TM) stencils are packaged in groups of (10) in a small anti-static bag.

NOTE: Pricing is based on the number of BGA balls of the package. The standard pricing is set to the lowest cost/ball count and MAY NEED to be adjusted after ordering.

EXAMPLE FOR EXTRACTING THE NUMBER OF BALLS: P/N BS105640040040 has the number of balls in positions 3-6 in the part number scheme. BT80030030036 is  for a 800 ball device because of the numbers n positions 3-5 in the part numbering scheme.


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  • 5
    Fast to reorder this way

    Posted by Rita M on 10th Jun 2018

    We ended needing quite a few more of these and therefore re-ordered. The second time through it was much faster as no check plot required.

  • 4
    Good Product

    Posted by Robert G on 3rd May 2018

    Keep re-redering as this makes the placement of the BGA during the repair much easier. Once it is in place then the placement is simple. Thanks.