The stenciling system is very simple to use.
- Stencil Thickness: .008" (.202mm)
- Aperture Size: .020" (.51mm)
- Ball Count: 117
- Ball Pattern:
- Pitch: .039 (1.00mm)
- Component Body Size: 14.0mm x 10.0mm
This device will make your rework faster and simpler. This breakthrough method
allows you to simplify the placement/replacement of both area array devices
such as BGAs and CSPs as well as other leaded SMT devices. In addition the solder mask is repaired undernaeth the device eliminating hours of touch up work.
Delivery is 5 buisness days or less.