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BS56812735035076


Quantity:
Price:
$95.00
SKU:
BS56812735035076
Weight:
1.00 LBS
Availability:
Product ships within 5 days from order acceptance
Shipping:
Calculated at checkout
  • StencilQuik 568 ball count

Product Description

Stenciling System

The stenciling system is very simple to use.

  • Stencil Thickness: .004" (.101mm)
  • Aperture Size: .030" (.76mm)
  • Ball Count: 568
  • Ball Pattern:
  • Pitch: .050" (1.27mm)
  • Component Body Size: 35.0mm x 35.0mm

    This device will make your rework faster and simpler. This breakthrough method
    allows you to simplify the placement/replacement of both area array devices
    such as BGAs and CSPs as well as other leaded SMT devices. In addition the solder mask is repaired undernaeth the device eliminating hours of touch up work.

    Delivery is 5 buisness days or less.

 

 

 

 

 

 

 

 

 

Product Videos

StencilQuik Demo Video | New BGA Placement Invention | BEST (01:49)
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.http://solder.net
  • StencilQuik De...
    StencilQuik demonstration video. This breakthrough method all...

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