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BS676100272771


Quantity:
Price:
$126.00
SKU:
BS676100272771
Weight:
1.00 LBS
Availability:
Product ships within 5 days from order acceptance
Shipping:
Calculated at checkout
  • Image 1

Product Description

BGA REWORK STENCIL

The Stenciling System is very simple to use.

 

  • Stencil Thickness: .008 (.203mm)
  • Aperture Size: .028 (.71mm)
  • Ball Count: 676
  • Ball Pattern: 26 x 26 Full Array
  • Pitch: .040 (1mm)
  • Component Body Size: 27mm x 27mm

    This device will make your rework faster and simpler. This breakthrough method
    allows you to simplify the placement/replacement of both area array devices
    such as BGAs and CSPs as well as other leaded SMT devices.

    Standard lead time is (5) business days 24-48hr expedites are also available. The quantity is 10 per bag

Product Videos

StencilQuik Demo Video | New BGA Placement Invention | BEST (01:49)
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.http://solder.net
  • StencilQuik De...
    StencilQuik demonstration video. This breakthrough method all...
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