BT06410013010060

$74.00
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SKU:
BT06410013010060
Availability:
Product ships within 5 days from order acceptance
Weight:
1.00 LBS
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BT06410013010060

BGA REWORK STENCIL

The Stenciling System is very simple to use.

 

  • Stencil Thickness: .004 (.102mm)
  • Aperture Size: .024 (0.60mm)
  • Ball Count: 64
  • Ball Pattern: 13.0 x 10.0 Full Array
  • Pitch: .040 (1.00mm)
  • Component Body Size: 13.0mm x 10.0mm

    This device will make your rework faster and simpler. This breakthrough method
    allows you to simplify the placement/replacement of both area array devices
    such as BGAs and CSPs as well as other leaded SMT devices.

    Standard lead time is (5) business days 24-48hr expedites are also available. The quantity is 10 per bag

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