BGA REWORK STENCIL
The Stenciling System is very simple to use.
- Stencil Thickness: .004 (.102mm)
- Aperture Size: .27mm
- Ball Count: 2203
- Ball Pattern: 25 x 27 Mixed Array
- Pitch: .644 and .477mm
- Component Body Size: 27mm x 27mm
This device will make your rework faster and simpler. This breakthrough method
allows you to simplify the placement/replacement of both area array devices
such as BGAs and CSPs as well as other leaded SMT devices.
Standard lead time is (5) business days 24-48hr expedites are also available. The quantity is 10 per bag