StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed polyimide stencils are placed on to the bottom of these device types. Solder paste is rolled in to the apertures. After reflow the stencil is removed, the device cleaned and now consistent, low voiding bumps are at the bottom of the device. This “bumped” leadless device part can now be placed just like a BGA or be fitted in to a matching stay in place stencil on the board.
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This leadless device rework process greatly simplifies and speeds up the replacement process. If you are a technician trying to hand build a more complex PCB prototype board this is your answer as the requirement for more complicated and time consuming placement equipment is eliminated. Solder voiding is severely limited as the flux has lots of open air to let the outgassing of the volatiles to escape and not be entrapped. The standoff height is also increased so that cleaning media can get underneath to remove any flux residue left behind after reflow.
The simple nature of the StencilMate™ rework process makes it easy for you to reliably and quickly place or replace leadless device packages such as QFN's or LGA's. The edges of the stencil are aligned with the sides of the package eliminating the need to use custom fixtures or frames. The adhesive has enough “tack” to hold the stencil in position once alignment of the stencil has been done. It does not have too much “tack” where if you mis-align the stencil, it will be impossible to remove and start over. After the device has been reflowed, the stencil is simply peeled off and the “bumped” device is ready for placement.
The StencilMate(TM) patterns are very numerous and therefore are made per order. Once you send us your files we look to whether or not it is in our library of files. If YES then we will send a check plot ASAP. If not our engineers will fabricate a drawing which you can proof prior to our fabrication. There are thousands of leadless device patterns for FNs, LGAs, PLCCs and others and it would be too confusing to have them all listed here and catalog them.
Independent lab testing has of files that we have already created for other confirmed (See Panel "B") that there are no harmful contaminants left behind as part of this process.
The StencilMate ™ stencils are custom made to your exact requirements using your part data sheet or Gerber file. There are NO tooling charges. The stencils are shipped in packages of 20 pieces. (10) for bumping your device and (10) board stencils. Alternately (20) part only QFN rework stencils may be provided. Product ships in 5 days after drawing approval.
NOTE: IPC 7711/21 Procedure 184.108.40.206. and 220.127.116.11 are the StencilMate(TM) processes.