Are you tired of the existing leadless device rework methods being in the hands of process experts due to the complexities and the dexterity required? Are you looking for a faster, more fool-proof leadless rework method? The new BEST StencilMate™ process is an answer to your QFN and LGA rework problems. This unique method simplifies the leadless device rework process allowing for better yields and faster rework times. These are shipped in 3-5 days.
The simple nature of the StencilMate™ rework process allows even the beginning repair technician to reliably and quickly replace leadless device packages such as QFNs or LGA packages. Alignment is simple with the edges of the stencil being “squared up” with the sides of the package thereby eliminating the need to use custom fixtures or frames. The adhesive is engineered such that it has enough “tack” to be held in place once you have aligned the stencil but not too much “tack” such that if you are misaligned it is impossible to start over. After the device has been reflowed, the stencil is simply peeled off and is ready to place.
The StencilMate ™ stencils are packaged and delivered to you the way you want. Stencils are custom made to your exact requirements without tooling charges. Order your Stencilmate(TM) bumping stencils here. They are packaged such that those building PCB prototypes or removing and replacing leadless devices can use them.
Order your FREE evaluation kit here.
NOTE: IPC 7711/21 Procedure 18.104.22.168. and 22.214.171.124 are the StencilMate(TM) processes.