This is a unique stenciling BGA reballing system. It improves first pass yields and makes the reballing of devices fast and simple.

This BGA manual reballing system allows you to easily change alloys or reball devices after their removal.

BGA reballing preforms come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305), high temp

More information on the testing of this device can be found here.

• Minimum Aperture Size: .002in (.05mm)

• Stencil Material: High temperature Polyimide with tacky, porous tape whihc cleans up with IPA.
  

• Minimum Pitch: .020in (0.3mm)

• Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)

We accept either standard GERBER files, part data sheets or CAD files.

This configurable part number means you do not have to sort through all of the patterns listed (there are many more).

The data you sned us to make your part must have:

         # of solder balls

         Pattern of the solder array incl dimensions

         Overall package size

         Ball size

We will send you a checkplot/drawing of the device we will fabricate for you.

EZReball(TM) stencils are packaged in groups of (15) in a small antistatic bag.