IF YOU HAVE AN existing EZReball(TM) pattern/part number - you have come to the right place.
Simply know your part number, type it in to the field and we will look up your previous order. There may need to be some adjustments on the pricing due to ball counts and pitches but by ordering this part you leave this research up to us. We then pull out the engineering drawings and build it. If you still want a check plot please put that notation in the comment field on the order screen.
This is a unique BGA reballing stencil. It improves first pass yields and makes the reballing of devices fast and simple.
This BGA reballing stencil allows you to easily change alloys or reball devices after their removal.
BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305), high temp
More information on the testing of this device can be found here.
- Minimum Aperture Size: .002in (.05mm)
- Stencil Material: High temperature Polyimide with tacky, porous tape which cleans up with IPA.
- Minimum Pitch: 1.50-0.50mm pitch
- Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)
EZReball(TM) BGA reballing stencils are packaged in groups of (15) in clam shell packaging.
Standard lead time is (3) business days for 2 packs.