The Universal EZReball Kit includes all of the materials you need to reball most BGAs that you will encounter. These reballing preforms together with your specified solder paste flux will give you the tools you need to reball BGAs and other area array devices quickly and reliably.
This kit equips you with the necessary tin/lead EZReball(TM) preforms to reball 0.5mm, 0.8mm, 1.0mm, 1.27mm, and 1.5mm pitch area array devices. Full array EZReball patterns can be customized by applying paste flux to your part and placing the device on top of the EZReball preform. The solder spheres will then flow to the appropriate pads for your array.
This kit includes the following items:
RI67605014014030 QTY 3
RD84108024024051 QTY 3
RC102410033033064 QTY 3
RB102412742042076 QTY 3
RB67615039039076 QTY 3
This BGA reballing kit is your emergency repair kit for those emergency PCB repair jobs.