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BS056080080858


Quantity:
Price:
$74.00
SKU:
BS056080080858
Weight:
1.00 LBS
Availability:
Product ships within 5 days from order acceptance
Shipping:
Calculated at checkout
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Product Description

Stenciling System

The Stenciling System is very simple to use.

 

  • Stencil Thickness: .004 (.102mm)
  • Aperture Size: .023 (.58mm)
  • Ball Count: 56
  • Ball Pattern: 8 x 8 Perimeter Array
  • Pitch: .031 (.8mm)
  • Component Body Size: 8mm x 8mm

    This device will make your rework faster and simpler. This breakthrough method
    allows you to simplify the placement/replacement of both area array devices
    such as BGAs and CSPs as well as other leaded SMT devices.

    Please plan on two week delivery time.

 

Product Videos

StencilQuik Demo Video | New BGA Placement Invention | BEST (01:49)
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.http://solder.net
  • StencilQuik De...
    StencilQuik demonstration video. This breakthrough method all...

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