BS100100111171

$74.00
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SKU:
BS100100111171
Availability:
Product ships within 5 days of order acceptance
Weight:
1.00 LBS
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BS100100111171

BGA REWORK STENCIL

The Stenciling System is very simple to use.

 

  • Stencil Thickness: .008 (.203mm)
  • Aperture Size: .028 (.71mm)
  • Ball Count: 100
  • Ball Pattern: 11.0 x 11.0 Full Array
  • Pitch: .040 (1.00mm)
  • Component Body Size: 11.0mm x 11.0mm

    This device will make your rework faster and simpler. This breakthrough method
    allows you to simplify the placement/replacement of both area array devices
    such as BGAs and CSPs as well as other leaded SMT devices.

    Standard lead time is (5) business days 24-48hr expedites are also available. The quantity is 10 per bag

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