BS12008015013050

$74.00
(No reviews yet) Write a Review
SKU:
BS12008015013050
Weight:
0.00 LBS
Shipping:
Calculated at Checkout
StencilQuik BGA Rework Stencil

BGA REWORK STENCIL

The Stenciling System is very simple to use.

 

  • Stencil Thickness: .008 (.203mm)
  • Aperture Size: .020 (.50mm)
  • Ball Count: 120
  • Ball Pattern: 15.0 x 13.0 Staggered Array
  • Pitch: .030 (.80mm)
  • Component Body Size: 15.0mm x 13.0mm

    This device will make your rework faster and simpler. This breakthrough method
    allows you to simplify the placement/replacement of both area array devices
    such as BGAs and CSPs as well as other leaded SMT devices.

    Standard lead time is (5) business days 24-48hr expedites are also available. The quantity is 10 per bag