BS169150232384

$74.00
Write a Review
SKU:
BS169150232384
Availability:
Product ships within 5 days from order acceptance
Weight:
1.00 LBS
Shipping:
Calculated at Checkout
BS169150232384

Title Optimization Test - BEST INC.

BGA REWORK STENCIL

The Stenciling System is very simple to use.

 

  • Stencil Thickness: .008 (.203mm)
  • Aperture Size: .033 (.84mm)
  • Ball Count: 169
  • Ball Pattern: 13 x 13 Full Array
  • Pitch: .059 (1.50mm)
  • Component Body Size: 15mm x 15mm

    This device will make your rework faster and simpler. This breakthrough method
    allows you to simplify the placement/replacement of both area array devices
    such as BGAs and CSPs as well as other leaded SMT devices.

    Standard lead time is (5) business days 24-48hr expedites are also available. The quantity is 10 per bag

Videos Hide Videos Show Videos