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BS176100151571


Quantity:
Price:
$74.00
SKU:
BS176100151571
Weight:
1.00 LBS
Availability:
Ships w/in 5 days of order + clarification of details
Shipping:
Calculated at checkout
  • Image 1

Product Description

BGA REWORK STENCIL

The Stenciling System is very simple to use.

  • Stencil Thickness: .008" (.203mm)
  • Aperture Size: .028" (.71mm)
  • Ball Count: 176
  • Ball Pattern: 15 x 15mm Perimeter Array
  • Pitch: .040" (1.00mm)
  • Component Body Size: 15mm x 15mm
  • This device will make your rework faster and simpler. This breakthrough method allows you to simplify the placement/replacement of both area array devices
    such as BGAs and CSPs as well as other leaded SMT devices.

    The quantity is 10 per bag.

Product Videos

StencilQuik Demo Video | New BGA Placement Invention | BEST (01:49)
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.http://solder.net
  • StencilQuik De...
    StencilQuik demonstration video. This breakthrough method all...

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