BGA REWORK STENCIL
The Stenciling System is very simple to use.
- Stencil Thickness: .008" (.203mm)
- Aperture Size: .028" (.71mm)
- Ball Count: 176
- Ball Pattern: 15 x 15mm Perimeter Array
- Pitch: .040" (1.00mm)
- Component Body Size: 15mm x 15mm
This device will make your rework faster and simpler. This breakthrough method allows you to simplify the placement/replacement of both area array devices
such as BGAs and CSPs as well as other leaded SMT devices.
The quantity is 10 per bag.