BS217080151558

$74.00
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SKU:
BS217080151558
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Product ships within 5 days from order acceptance
Weight:
1.00 LBS
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BS217080151558

BGA REWORK STENCIL

The Stenciling System is very simple to use.

 

  • Stencil Thickness: .008 (.203mm)
  • Aperture Size: .023 (.58mm)
  • Ball Count: 217
  • Ball Pattern: 15 x 15 Perimeter Array
  • Pitch: .030 (.80mm)
  • Component Body Size: 15mm x 15mm

    This device will make your rework faster and simpler. This breakthrough method
    allows you to simplify the placement/replacement of both area array devices
    such as BGAs and CSPs as well as other leaded SMT devices.

    Standard lead time is (5) business days 24-48hr expedites are also available. The quantity is 10 per bag

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