The Stenciling System is very simple to use.
- Stencil Thickness: .008 (.203mm)
- Aperture Size: .032 (.81mm)
- Ball Count: 225
- Ball Pattern: 26 x 26 Full Array
- Pitch: .060 (1.50mm)
- Component Body Size: 26mm x 26mm
This device will make your rework faster and simpler. This breakthrough method
allows you to simplify the placement/replacement of both area array devices
such as BGAs and CSPs as well as other leaded SMT devices.
Please plan on two week delivery time. The quantity is 10 per bag.