BS360127252592

$74.00
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SKU:
BS360127252592
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BS360127252592

BGA REWORK STENCIL

The Stenciling System is very simple to use.

 

  • Stencil Thickness: .008 (.203mm)
  • Aperture Size: .036 (.92mm)
  • Ball Count: 360
  • Ball Pattern: 25.0 x 25.0 Full Array
  • Pitch: .050 (1.27mm)
  • Component Body Size: 25.0mm x 25.0mm

    This device will make your rework faster and simpler. This breakthrough method
    allows you to simplify the placement/replacement of both area array devices
    such as BGAs and CSPs as well as other leaded SMT devices.

    Standard lead time is (5) business days 24-48hr expedites are also available. The quantity is 10 per bag

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