BS520127434384

$95.00
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BS520127434384
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BS520127434384

BGA REWORK STENCIL

The Stenciling System is very simple to use.

 

  • Stencil Thickness: .008 (.203mm)
  • Aperture Size: .033 (.84mm)
  • Ball Count: 520
  • Ball Pattern: 33 x 33 Perimeter Array
  • Pitch: .050 (1.27mm)
  • Component Body Size: 43mm x 43mm

    This device will make your rework faster and simpler. This breakthrough method
    allows you to simplify the placement/replacement of both area array devices
    such as BGAs and CSPs as well as other leaded SMT devices.

    Standard lead time is (5) business days 24-48hr expedites are also available. The quantity is 10 per bag