BGA REWORK STENCIL
The Stenciling System is very simple to use.
- Stencil Thickness: .008 (.203mm)
- Aperture Size: .033 (.84mm)
- Ball Count: 625
- Ball Pattern: 25 x 25 Full Array
- Pitch: .050 (1.27mm)
- Component Body Size: 32.3mm x 32.3mm
This device will make your rework faster and simpler. This breakthrough method
allows you to simplify the placement/replacement of both area array devices
such as BGAs and CSPs as well as other leaded SMT devices.
Standard lead time is (5) business days 24-48hr expedites are also available. The quantity is 10 per bag