BGA REWORK STENCIL
The Stenciling System is very simple to use.
- Stencil Thickness: .004 (.102mm)
- Aperture Size: .023 (0.58mm)
- Ball Count: 144
- Ball Pattern: 14 x 14 Full Array
- Pitch: .031 (.80mm)
- Component Body Size: 13mm x 13mm
This device will make your rework faster and simpler. This breakthrough method
allows you to simplify the placement/replacement of both area array devices
such as BGAs and CSPs as well as other leaded SMT devices.
Standard lead time is (5) business days 24-48hr expedites are also available. The quantity is 10 per bag