PS-3 Reballing

EZReball™ reballing preforms can be used to reball a variety of devices inside of a PS-3. These include the chipsets listed below along with the various descriptions and the associated part numbers for PS-3 reballing.

CXD9833GB PS-3 Chipset

StencilQuik(TM) used for gaming

RC132010042042064LF

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on PS3-2 devices

RC123610042042064LF

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on CXD2964GB (PS3 CPU)  devices. This preform is lead free. Ball Size: 0.64mm Ball Count:...

RB100512743043076LF

BGA Reball Preform This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on RG828t5 (XBOX, PS3, wii GPU_CPU) devices

PS-3 reballing is necessary when the PS-3 gamins system needs to be repaired. Using the EZReball™ reballing preforms the DIY repair shop or user can easily reball a device after taking it off.

There are only a few tools required for PS-3 reballing including a heating source (which can be a toaster oven), flux paste, isopropyl alcohol and a soft brush for cleaning and some type of magnification to aid in inspection. After prepping the device for reballing it is placed on top of the reballing preform, squared up with the package dimensions or alignment, reflow, preform removed and then cleaned and inspected.

If the supply chain has suspect parts it is always a surer thing to just replace the solder balls as part of the PS-3 reballing process then replace the device with a part from an unknown source.

In order to get a custom pack of EZReball preforms look here.