RB100512743043076LF

$252.00
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SKU:
RB100512743043076LF
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
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Calculated at Checkout
Reballing Preform for RG82875 - XBOX, PS3, wii GPU_CPU

BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on RG828t5 (XBOX, PS3, wii GPU_CPU) devices. This preform is lead free.

  • Ball Size: 0.76mm
  • Ball Count: 567
  • Ball Pattern: 38x38 mm
  • Pitch: 1.27 mm

The quantity is 15 per bag.

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