Description
Reviews
Videos
Description
BGA Reball Preform
This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on RG828t5 (XBOX, PS3, wii GPU_CPU) devices. This preform is lead free.
- Ball Size: 0.76mm
- Ball Count: 567
- Ball Pattern: 38x38 mm
- Pitch: 1.27 mm
The quantity is 15 per bag.