Reballing Preform for RG82875 - XBOX, PS3, wii GPU_CPU

RB100512743043076LF

$252.00
SKU:
RB100512743043076LF
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
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Description

Description

BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on RG828t5 (XBOX, PS3, wii GPU_CPU) devices. This preform is lead free.

  • Ball Size: 0.76mm
  • Ball Count: 567
  • Ball Pattern: 38x38 mm
  • Pitch: 1.27 mm

The quantity is 15 per bag.

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