RB40012727027076LF

$115.00
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SKU:
RB40012727027076LF
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
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Reballing preform for Broadcom Integrated 24FE

BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on Broadcom Integrated 24FE / BCM53242 devices. This preform is lead free.

  • Ball Size: 0.76mm
  • Ball Count: 400
  • Ball Pattern: 27x27 mm
  • Pitch: 1.27 mm

The quantity is 15 per bag.

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