BGA Reball Preform
This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on Broadcom Integrated 24FE / BCM53242 devices. This preform is lead free.
- Ball Size: 0.76mm
- Ball Count: 400
- Ball Pattern: 27x27 mm
- Pitch: 1.27 mm
The quantity is 15 per bag.
