Reballing preform for Broadcom Integrated 24FE

RB40012727027076LF

$115.00
SKU:
RB40012727027076LF
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
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Description

Description

BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on Broadcom Integrated 24FE / BCM53242 devices. This preform is lead free.

  • Ball Size: 0.76mm
  • Ball Count: 400
  • Ball Pattern: 27x27 mm
  • Pitch: 1.27 mm

The quantity is 15 per bag.

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