BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on 845MP/855PM Chipset devices. This preform is lead free.

• Ball Size: 0.76mm
• Ball Count: 593
• Ball Pattern: 38x38 mm
• Pitch: 1.27 mm

The quantity is 15 per bag.