Reballing preform for Intel 845MP/855PM Chipset

RB59312738038076LF

$149.00
SKU:
RB59312738038076LF
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
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Description

Description

BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on 845MP/855PM Chipset devices. This preform is lead free.

  • Ball Size: 0.76mm
  • Ball Count: 593
  • Ball Pattern: 38x38 mm
  • Pitch: 1.27 mm

The quantity is 15 per bag.

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