BGA Reball Preform
This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on Intel 845MP/855PM Chipset devices. This preform is lead free.
- Ball Size: 0.76mm
- Ball Count: 593
- Ball Pattern: 38x38 mm
- Pitch: 1.27 mm
The quantity is 15 per bag.
