BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on 855GME Intel Memory Controller Hub devices. This preform is lead free.

• Ball Size: 0.76mm
• Ball Count: 732
• Ball Pattern: 38x38 mm
• Pitch: 1.27 mm

The quantity is 15 per bag.