RC193210045045064LF

$315.00
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SKU:
RC193210045045064LF
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
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Calculated at Checkout
Reballing preform for BCM56639

BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BCM56639 Modular Ethernet Line Cards devices. This preform is lead free.

  • Ball Size: 0.64mm
  • Ball Count: 1,932
  • Ball Pattern: 45x45mm
  • Pitch: 1.00 mm

The quantity is 15 per bag.

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