RC208100171764LF

$115.00
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SKU:
RC208100171764LF
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
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EZReball(TM) Reballing Preform   RC208100171764LF

BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. This preform is lead free.

  • Ball Size: 0.64mm
  • Ball Count: 208
  • Ball Pattern: 17x17 mm
  • Pitch: 1.0 mm

The quantity is 15 per bag.

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