RC256100171764

$115.00
SKU:
RC256100171764
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
Shipping:
Calculated at Checkout
Current stock: 0
Description

Description

BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices.The quantity is 15 per bag.

  • Stencil Thickness:0.012
  • Aperture Size:.64mm
  • Ball Count:256
  • Ball Pattern:17x17mm
  • Pitch: 1.0 mm
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