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BGA Reball Preform
This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on 9600-T2 devices. This is intended for reballing ATI FGL 9600 Grpaphic processor chips. This preform is lead free.
- Ball Size: 0.64mm
- Ball Count: 715
- Ball Pattern: 31x31 mm
- Pitch: 1.00 mm
The quantity is 15 per bag.