BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on 9600-T2 devices. This is intended for reballing ATI FGL 9600 Grpaphic processor chips. This preform is lead free.

• Ball Size: 0.64mm
• Ball Count: 715
• Ball Pattern: 31x31 mm
• Pitch: 1.00 mm

The quantity is 15 per bag.