RC78010029029064LF

$198.00
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SKU:
RC78010029029064LF
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Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
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Reballing preform for WiiGPUAA

BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on WiiGPUAA devices. This preform is lead free.

  • Ball Size: 0.64mm
  • Ball Count: 780
  • Ball Pattern: 29x29mm
  • Pitch: 1.00 mm

The quantity is 15 per bag.

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