RC84710035035064LF

$198.00
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SKU:
RC84710035035064LF
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
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Reballing preform Core Duo Chipset

BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on Core Duo Chipset (SIS671) devices. This preform is lead free.

  • Ball Size: 0.76mm
  • Ball Count: 847
  • Ball Pattern: 35x35mm
  • Pitch: 1.00 mm

The quantity is 15 per bag.

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