BGA Reball Preform

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on 9100-IGP (ATI Radeon)  devices. This preform is lead free.

• Ball Size: 0.64mm
• Ball Count: 868
• Ball Pattern: 35x35mm
• Pitch: 1.00 mm

The quantity is 15 per bag.