RC89910031031064

$198.00
SKU:
RC89910031031064
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
Shipping:
Calculated at Checkout
Current stock: 0
Description

Description

BGA Reball Preform for XBOX 360 CPU

This preform will make your reballing of the XBOX 360 CPU faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices.The quantity is 15 per bag.

  • Stencil Thickness:0.12 .
  • Ball Size:.64 mm
  • Ball Count:899
  • Ball Pattern:31 x 31 mm
  • Pitch: 1.00 mm
Reviews

Reviews (0)

Be the first to review this product.
Videos

Related Products