BGA Reball Preform for XBOX 360 CPU

This preform will make your reballing of the XBOX 360 CPU faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices.The quantity is 15 per bag.

• Stencil Thickness:0.12 .
• Ball Size:.64 mm
• Ball Count:899
• Ball Pattern:31 x 31 mm
• Pitch: 1.00 mm