RD123608033033051LF

$252.00
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SKU:
RD123608033033051LF
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Reballing Preform for MSPII Midia System Processor

BGA Reball Preform-Lead Free SAC305 Alloy (Others available)

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. This preform is inteneded for MSPII Midia System Processor reballing. This preform is lead free.

  • Ball Size: 0.51 mm
  • Ball Count: 1236
  • Ball Pattern: 33x33 mm
  • Pitch: 0.80 mm

The quantity is 15 per bag.

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