RD150408035035051LF

$315.00
(No reviews yet) Write a Review
SKU:
RD150408035035051LF
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
Shipping:
Calculated at Checkout
BGA Reballing Preform for G94-300-A1

BGA Reball Preform-Lead Free SAC305 Alloy (Others available)

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. This preform is inteneded for G94-300-A1 reballing. This preform is lead free.

  • Ball Size: 0.51 mm
  • Ball Count: 1504
  • Ball Pattern: 35x35 mm
  • Pitch: 0.80 mm

The quantity is 15 per bag.

Videos Hide Videos Show Videos