RD69208025525551LF

$198.00
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SKU:
RD69208025525551LF
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
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Rebaling Preform for 8200/6100

BGA Reball Preform-Lead Free SAC305 Alloy (Others available)

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. This preform is inteneded for 8200/6100 reballing. This preform is lead free.

  • Ball Size: 0.51 mm
  • Ball Count: 692
  • Ball Pattern: 25.5x25.5 mm
  • Pitch: 0.80 mm

The quantity is 15 per bag.

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