RE16510015013046

$115.00
SKU:
RE16510015013046
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
Shipping:
Calculated at Checkout
Current stock: 0
Description

Description

BGA Reball Preform-Tin/Lead (other alloys available)

This preform will make your reballing faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. 

  • Ball Size: 0.51 mm
  • Ball Count: 165
  • Package size: 15x13mm
  • Pitch: 1.00 mm

The quantity is 15 per bag.

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