RE16510017015546

$115.00
SKU:
RE16510017015546
Availability:
Ships within 3-5 days of order + clarification of details
Weight:
1.00 LBS
Shipping:
Calculated at Checkout
Expedite Service (24-48 hrs, up to 2 packs only)
Current stock: 0
Description

Description

BGA Reball Preform-Tin/Lead (other alloys available)

This preform will make your reballing faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. 

  • Ball Count: 165
  • Package size: 17x15.5mm
  • Pitch: 1.00 mm

The quantity is 15 per bag.

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