This unique rework stenciling system is very simple to use.
Adhesive Backed Stencil Thickness: 004in (.10mm), .005in (.13mm) and .006in (.15mm)
Minimum Aperture Size: .002in (.05mm)
Stencil Material: Plastic film with release liner. The adhesive backed stencil features a low tack sticky note type of adhesive.
MinimumPitch: .020in (0.5mm)
Maximum Area: Approx 4 x 4in (100mm x 100mm)
This unique method simplifies the rework process allowing the stencil get in to tight spaces, get higher first pass yields as the paste processing window is much wider than with metal stencils. These rework one-time-use stencils are ideal for connectors, QFPs, and other areas on the PCB requiring rework. These adhesive backed stencils may be designed with or without a solder paste boarder surrounding the area to be reworked.
We accept either standard GERBER files, part data sheets or CAD files.
Standard lead time is 24-48 hours after file approval.
These adhesive backed stencils are packaged in groups of (10) in a small antistatic bag.