This solder paste is conveniently packaged in a 2 ounce jar eliminating the need for any waste due to product expiration. The lead free paste can be stored at room temperature. This is a SAC305 lead-free no clean alloy.
Solder paste can be used in wireless repair operations such as the repair of smart phones, tablets, laptops and other handheld devices. The lead-free solder paste can be squeegeed through the apertures of micro stencils, the micro stencils removed and then after device placement the component can be attached after reflow of the solder paste. The solder then has an intermetalic bond to the PCB and the device being soldered. This lead free solder alloy does not need to be cleaned afterwards and is compatible with all wireless products produced since 2006.
This item is stocked and can ship within 1-2 business days.