SolderPasteDippingPlate

$150.00
SKU:
SolderPasteDippingPlate
Weight:
5.00 LBS
Shipping:
Calculated at Checkout
Maximum file size is: 20000KB
Maximum file size is: 20000KB
Maximum file size is: 20000KB
Current stock: 0
Description

Description

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on to a board or other device. It can also be used to dip flux of pre-bumped device.

These plates are custom-made and can be ordered to accommodate different component sizes and ball diameters.

The dipping plates can be used as stand-alone entities or be used with the tooling holes on PACE, SRT, AirVac, Oki or other rework systems.

Delivery is 2-3 days after drawing approval by the customer.

In order to get started we require the following:

  1. Part mechanicals
  2. Type of machine the plate will be used with or free-standing
Reviews

Reviews (1)

Jackson H 27th Jul 2017

Good Work

They asked lots of process questions. Got the stencil right. Also included markings I wanted.

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