This is a unique BGA reballing preform for pitches GREATER than 0.4mm for existing parts.

EZReball(TM)  improves first pass yields and makes the reballing of devices fast and simple.

This BGA reballing stencil allows you to easily change alloys or reball devices after their removal.

BGA reballing stencils come in a variety of alloys including but not limited to : tin-lead, lead free (SAC 305) high temp 

More information on the testing of this device can be found here.

• Minimum Aperture Size: .002in (.05mm)

• Stencil Material: High temperature Polyimide with tacky, porous tape which cleans up with IPA.
  

• Minimum Pitch: 1.50-0.50mm pitch
  

• Maximum Stencil Size: Approx 4 x 4in (100mm x 100mm)

This is for those WITH AN EXISTING EZReball(TM) part number for re-order.

We will NOT send you a checkplot/drawing of the device unless you specifically ask for it as this is a re-order.

EZReball(TM) BGA reballing stencils are packaged in groups of (15) in clam shell packaging.

Standard lead time is (3) business days for 2 packs. NOTE: There is no need for alignment fixtures as the patterns square up to the package dimensions for alignment.