BGA Reball Preform-Lead Free SAC305 Alloy (Others available)

This preform will make your rework faster and simpler. This breakthrough method allows even the novice to replace solder balls on BGA devices. This preform is intended for MCP7A-P-B1  reballing. This preform is lead free.

• Ball Size: 0.51 mm
• Ball Count: 1449
• Ball Pattern: 33.5x33.5 mm
• Pitch: 0.80 mm

The quantity is 15 per bag.