Solder Paste Dipping Plate

5.00 LBS
Calculated at Checkout
Maximum file size is: 20000KB
Maximum file size is: 20000KB
Maximum file size is: 20000KB
Current stock: 0


These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on to a board or other device. It can also be used to dip flux of pre-bumped device.

These plates are custom-made and can be ordered to accommodate different component sizes and ball diameters.

The dipping plates can be used as stand-alone entities or be used with the tooling holes on PACE, SRT, AirVac, Oki or other rework systems.

Delivery is 2-3 days after drawing approval by the customer.

In order to get started we require the following:

  1. Part mechanicals
  2. Type of machine the plate will be used with or free-standing

Reviews (2)

Sally T 21st Apr 2020

Nice company to work with

Will buy again

Jackson H 27th Jul 2017

Good Work

They asked lots of process questions. Got the stencil right. Also included markings I wanted.

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