Now updated to Revision F of the latest IPC-A-610F and J-STD-001F – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections.
With 44 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these small and convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions for Clas I, II or III.
Useful as a training aid in the classroom or on the shop floor, DRM-SMT-F contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints. Each drawing clearly shows the minimum acceptable condition for each type of component misalignment; and details all of the specifications for minimum/maximum solder joint size, including fillet heights and lengths.
This DRM-SMT-F verison covers the the standards for BGAs and BTCs, both of whihc are found in the standard.
DRM-SMT-F also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead-free solder connections. The appropriate specification/paragraph references from both the IPC-A-610E and J-STD-001E are included for each of the acceptance criteria for further verification.