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BEST HotDots™ are a versatile, clean and effective method of attaching jumper wires and other elements of a PCB in place during the assembly process. HotDots™ are designed to “take the heat” as they are made from a polyimide film using an engineered high temperature adhesive system. This material combination has already been proven to stay in place during wave and reflow soldering processes and bake-out cycles as tens of thousands of rework stencils have been placed on boards using this material. The see through material allows you to be sure of your placement.
HotDots™ are cut in to a variety of shapes (including custom configurations)
Butterfly shapes hold the wire in the center cut out area and then “fan out” to the PCB surface giving the largest possible holding surface area. Round shapes can also be cut for the smallest possible footprint on the PCB.
The HotDot™ adhesive system is a semi permanent effective way to get the wires or other elements to stick to the board-wherever you need in the process. The HotDots™ are simply peeled back from the backing material and placed onto the PCB. Heat and/or pressure will activate the adhesive in order for the material to be adhered to the board. The result is a highly conformable, high strength bond.
Make sure the bonding surface is clean, free of oils and other contaminants in order to achieve the desired bond strength. It is recommended that prior to bonding if the surface Is suspected of contamination that it be cleaned with isopropyl alcohol. Avoid placing HotDot™ dots directly over exposed copper or plated surfaces.
These HotDots™ are delivered on a backing sheet in the following sizes and quantities:
HotDot™ , Round, Diameter 4mm Qty –993count
HotDot™ , Round, Diameter 6.4mm Qty –529 count
HotDot™ , Round, Diameter 8mm Qty –272count
HotDot™ , Round, Diameter 10mm Qty –272count
HotDot™ , Butterfly, Width 4mm Qty –993count
HotDot™ , Butterfly, Width 6.4mm Qty –529count
HotDot™ , Butterfly, Width 8mm Qty –272count
HotDot™ , Butterfly, Width 10 mm Qty –272count
- 2-4 minute service temperature range at reflow temperatures
- Great dimensional stability-even during reflow cycles
- Impervious to most processing chemicals typically found in SMT assembly including sapnifiers and mild acids
- Temp range range: High short term of350C+
- Shelf life of 2 years without causing adhesive transfer or loss of bond strength
Call BEST Inc (847) 797-9250 for custom configurations